2.1 Full in‑house manufacturing workflow
Crystal growth → slicing → lapping → annealing → CMP polishing → clean‑room packaging, no intermediate outsourcing for stable quality control.
Large‑Diameter Single Crystal Sapphire Wafer Substrate (In‑House Crystal Grown)
- group name
- Sapphire Optical Windows
- Min Order
- 1 piece
- brand name
- FELIX GLASS optical glass Manufacturing base
- model
- FG-CSOC-LD201
- Nearest port for product export
- Shenzhen, Guangzhou
- Delivery clauses under the trade mode
- FOB, CFR, CIF, EXW, FAS, CIP, FCA, CPT, DEQ, DDP, DDU, Express Delivery, DAF, DES
- Acceptable payment methods
- T/T, L/C, D/P D/A, MoneyGram, Credit Card, PayPal, Westem Union, Cash, Escrow
- update time
- Fri, 11 Sep 2026 03:40:27 GMT
Paramtents
Material Single‑crystal α‑Al₂O₃ Sapphire, Purity ≥99.996% (In‑house crystal growth)
Available Diameter 2",3",4",6",8", up to 12"(300mm), custom sizes supported
Crystal Orientation C‑plane(0001), A‑plane(11‑20), M‑plane(10‑10), R‑plane(1‑102)
Surface Finish SSP Single‑Side Polished / DSP Double‑Side Polished / Lapped / As‑Slic
TTV 100μm‑2000μm, customizable
Roughness Ra ≤0.5nm (Polished surface)
Manufacturing Process Ingot growth → X‑ray orientation → Multi‑wire slicing → Lapping → Annealing → CMP polishing → Clean‑
Packaging Class‑100 clean wafer box, anti‑static packaging
Application GaN epitaxy, LED, semiconductor RF device, aerospace IR window, deep‑sea ROV viewport, thin‑film dep
Packging & Delivery
-
Min Order1 piece
Briefing
sapphire wafer, high‑purity α‑Al₂O₃, SSP/DSP options, custom orientation & size for GaN epitaxy and aerospace optical applications.
Detailed
Hong Kong Felix Optical Glass Co., Limited · Model FG‑CSOC‑SPW030
Large‑Diameter Custom Sapphire Wafers | α‑Al₂O₃ Substrates
Hong Kong Felix Optical Glass Co., Limited delivers high‑quality custom precision sapphire wafers manufactured fully in‑house. Made from monocrystalline α‑Al₂O₃, these substrates support SSP / DSP polishing for GaN epitaxy, aerospace EO/IR, deep‑sea ROV, high‑temperature optical and semiconductor applications. Strict clean‑room production guarantees low TTV, high flatness and ultra‑low surface roughness for high‑yield epitaxial processing.
This product belongs to Custom Sapphire Optical Components, optimized for semiconductor and aerospace optical engineer search intent.
All parameters shown are typical reference values. Final dimension, crystal orientation, polishing grade and tolerance shall be confirmed by official engineering drawings and project specifications.
Material & optical advantages
2. Key Advantages of Custom Sapphire Wafers
Our monocrystalline sapphire wafer series solves core engineering requirements for semiconductor epitaxy, aerospace and deep‑sea optical systems, delivering high flatness, low defect density and outstanding environmental stability.
2.2 Multiple crystal orientations available
C‑plane, A‑plane, R‑plane, M‑plane to match LED, Micro‑LED, power‑semiconductor and optical‑grade application requirements.
2.3 Superior thermal‑chemical performance
Excellent high‑temperature, plasma and corrosion resistance for aerospace, deep‑sea and harsh industrial operating environments.
Explore more optical parts in Felix Glass product catalog.
Typical application scenarios
3. Main Application Fields for Sapphire Wafers
Monocrystalline α‑Al₂O₃ sapphire wafers are widely deployed across semiconductor epitaxy, aerospace optoelectronics and deep‑sea observation equipment.
- LED / Micro‑LED Epitaxy: C‑plane sapphire substrates for GaN‑based LED, Mini‑LED and Micro‑LED mass production.
- Power Semiconductor: Oriented sapphire for semiconductor research and pilot‑run projects.
- Aerospace EO/IR: High‑strength sapphire windows and dome components for airborne optical payloads.
- Deep‑sea ROV/AUV: Pressure‑resistant optical windows working under extreme seawater conditions.
- Industrial high‑temperature equipment: Observation windows for high‑temperature and corrosive chambers.
- Laser & sensor assemblies: Optical‑grade sapphire substrates for precision optical sensing modules.
TTV, bow, warp and surface roughness directly determine epitaxy yield. Submit drawing for manufacturability review.
Drawing‑driven precision manufacturing
4. In‑House Sapphire Wafer Manufacturing Workflow
Hong Kong Felix Optical Glass implements full‑chain control inside clean‑room facilities for large‑diameter sapphire wafer production.
Crystal growth
High‑quality monocrystalline α‑Al₂O₃ sapphire ingot preparation.
Wire‑saw slicing
Precision wire‑saw slicing to target wafer thickness.
Lapping & stress‑relief annealing
Surface lapping plus thermal annealing to eliminate slicing internal stress.
CMP polishing & RCA clean
Rough/fine polishing, final CMP chemical‑mechanical polishing and RCA clean‑room cleaning.
- 1
Sapphire crystal growth
- 2
Precision wire‑saw slicing
- 3
Lapping & stress‑relief annealing
- 4
Rough & fine polishing
- 5
CMP final chemical‑mechanical polishing
- 6
Clean‑room RCA cleaning & inspection
- 7
Vacuum wafer carrier packaging
View our manufacturing strength on About Us.
Material selection guide
5. Substrate Optical‑Mechanical Performance
Large‑diameter sapphire wafers support multiple crystal planes and polishing grades for different semiconductor and optical projects.
Every wafer batch goes through TTV, bow, warp, surface roughness and defect inspection inside clean‑room before delivery. Customers can specify inspection standards according to epitaxy or optical design requirements.
Find more design suggestions in our technical blog.
Material Selection Guide
6. Customizable Specification Parameters
Below lists common custom options. Our engineers will evaluate manufacturability after receiving your CAD drawings.
| Specification item | Available options | Project confirmation factor |
|---|---|---|
| Material | Single‑crystal α‑Al₂O₃ Sapphire | Optical / semiconductor application spectrum & operating environment |
| Available Diameter | 2",3",4",6",8", up to 12", custom sizes | Epitaxy equipment chuck size, assembly mechanical constraints |
| Thickness Range | 0.25 mm‑1.0 mm, custom thickness upon request | Wafer handling strength, device‑process requirements |
| Crystal Orientation | C‑plane (0001), A‑plane (11‑20), R‑plane (01‑12), M‑plane (10‑10) | Epitaxial film growth requirement, device design |
| Polishing Grade | SSP(Single‑Side Polished), DSP(Double‑Side Polished), Lapped | Epitaxy process, optical transmission demand |
| TTV | ≤10 μm (epitaxy grade, customizable) | Photolithography & epitaxy yield target |
| Surface Roughness Ra | ≤0.5 nm (CMP polished surface) | Epitaxy layer quality, scattering‑loss requirement |
| Notch / Flat Marking | Notch, primary flat, secondary flat, custom orientation mark | Wafer‑handling equipment compatibility |
| Packaging | Class‑100 clean‑room wafer carrier, vacuum sealed | Fab incoming‑particle‑control requirement |
Sample & mass‑production lead‑time
7. Production Cycle for Prototypes & Volume Orders
After drawing review, crystal orientation and polishing specification confirmed, lead‑time reference as follows:
- 1
Prototype samples: 15‑20 working days
For epitaxy trial, optical performance and process verification.
- 2
Pilot small‑batch: 20‑28 working days
Process validation before formal mass‑production.
- 3
Mass‑production orders: 28‑40 working days
Actual delivery depends on ingot blank stock, CMP capacity and clean‑room scheduling.
Class‑100 clean‑room wafer carrier + vacuum‑sealed export‑grade packaging, suitable for air freight to semiconductor fabs.
Technical FAQ
8. Sapphire Wafer Frequently Asked Questions
Below are typical performance descriptions. Real indicators must match project drawings and fab incoming‑inspection specification.
Which crystal plane for GaN LED epitaxy?
C‑plane (0001) is industry standard for GaN‑based LED / Micro‑LED epitaxy. Send your device specification for further consultation.
Can you provide 12‑inch large‑diameter sapphire wafer?
Yes, we support up to 12‑inch custom sapphire wafers. Please share your equipment chuck drawing for manufacturability evaluation.
Can you supply metrology test reports for each batch?
We can provide TTV, bow‑warp, surface‑roughness inspection reports for each batch for fab incoming‑quality audit.
What is difference between SSP and DSP sapphire wafer?
SSP: only working side CMP polished; DSP: both‑side CMP polished, better flatness for high‑end lithography‑related epitaxy process.
Do you accept small‑quantity R&D prototype orders?
Yes, we support small‑batch R&D prototype for semiconductor research institutes and aerospace project teams.
Can you do custom notch / flat orientation marking?
Notch, primary‑flat and secondary‑flat orientation marking are available according your wafer‑handling equipment requirements.
RFQ preparation checklist
Submit project requirements
Request Quotation & Custom Drawing Review
Please provide target diameter, thickness, crystal orientation, polishing grade, notch/flat requirement and estimated quantity. Our optical‑semiconductor engineering team will return formal quotation and lead‑time within 24 working hours.